2008 ASM AB 559A Alu bonder
- Auction:
- Assembly Machines
- Lot:
- A1-25853-3
- Veenendaal, NL
Collection on fixed days
- Current bid
- Status
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About this lot
ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie, designed for the multi-point connection of large-scale integrated circuit chips. The device offers a range of features and capabilities that make it suitable for a variety of microelectronic chip assembly applications. Wedge bonder, bond head 60°, 10 bar (145 psi), Supplied pressure 5 bar (72.5 psi), Air consumption 63 1/min (2.2 cfm), Rating: 15A-125V, 1875 Watts, SVT Beldfoil shielded, AWG Stranding: 14 (41x30), Diameter1.91 mm, 230 VAC (Single phase) ± 5%, Frequency 50/60 Hz, Power consumption 800 W
- Auction:
- Assembly Machines
- Lot number:
- A1-25853-3
- Location:
- Veenendaal, NL
- Sold by:
- Company seller
Lot specifications
- Quantity
- 1
- Margin
- No
- Brand
- ASM
- Type
- AB 559A
- Year of build
- 2008
- Serial number
- 59A-32-654 XXXX
- Manual present
- Yes
- Electric connection
- 230V
- Own weight
- 480kg
Documents
Attention please!
There is no right of withdrawal.
The minimum age for visiting the viewing and pick-up days is 18 years old. Visitors must be able to identify themselves.
During the collection day, a forklift truck with driver is available, which can be used free of charge. The maximum lifting capacity is 1500 kg.
